Release Film Special For Flexible Printed Circuit Board FPC Lamination

Release Film Special for Flexible Printed Circuit Board (FPC) Lamination

Release film special for flexible printed circuit board (FPC) lamination is a special purpose thin film specially used in the process of flexible printed circuit board (FPC).

Release film special for flexible printed circuit board (FPC) lamination is also known or renamed as FPC release film, F-PCB lamination release film or functional release film used for FPC lamination.

Product Application:

FPC release film is working as the covering film used for the process of FPC or F-PCB lamination. During FPC lamination process, it is playing a functional role of isolation and separation. It is also used for false bonding and compression of EML and FR4.

Product Structure:

• Release layer
• High-temperature resistant PET substrate
• Release layer

Product Features:

1. It has double matte surfaces which can make the production operation easier.

2. The static electricity on the surface of the release film is small, which will not adsorb dust or other foreign objects that may cause defects.

3. The FPC release film has lower silicone oil transfer, which can minimize the pollution risk.

FPC Release film models:

flexible laminating film roll

flexible laminating release film

fpc laminating film roll

Release Film Special For Flexible Printed Circuit Board FPC Lamination Images